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contributor authorJi Li
contributor authorHuang Gao
contributor authorGary J. Cheng
date accessioned2017-05-09T00:39:12Z
date available2017-05-09T00:39:12Z
date copyrightDecember, 2010
date issued2010
identifier issn1087-1357
identifier otherJMSEFK-28418#061005_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/143974
description abstractThe microscale laser dynamic forming (LDF) process is a high strain rate microfabrication technique, which uses a pulse laser to generate high pressure by vaporizing and ionizing an ablative coating, and thus produces complex 3D microstructures in thin foils. One of the most important features of this technique is ultrahigh strain rate (typically 106–7 s−1), which is theoretically favorable for increasing formability. However, due to the lack of measurement techniques in microscale and submicroscale, the formability of workpieces in LDF is hardly studied. In this article, experiments were carried out on aluminum foils to study the forming limits and fracture of thin films in LDF. The deformation depth was measured by an optical profilometer and the formed feature was observed using a focused ion beam and a scanning electron microscope. Meanwhile, a finite element model based on a modified Johnson–Cook constitutive model and a Johnson–Cook failure model was developed to simulate the mechanical and fracture behaviors of materials in LDF. Experimental results were used to verify the model. The verified model was used to predict the forming limit diagram of aluminum foil in LDF. The forming limit diagrams show a significant increase in formability compared with other metal forming processes.
publisherThe American Society of Mechanical Engineers (ASME)
titleForming Limit and Fracture Mode of Microscale Laser Dynamic Forming
typeJournal Paper
journal volume132
journal issue6
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.4002546
journal fristpage61005
identifier eissn1528-8935
keywordsDeformation
keywordsAluminum
keywordsLasers
keywordsAluminum foil
keywordsFracture (Process)
keywordsMicroscale devices
keywordsFailure
keywordsThickness
keywordsPressure AND Constitutive equations
treeJournal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 006
contenttypeFulltext


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