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contributor authorDavid Newport
contributor authorColin Forno
contributor authorMaurice Whelan
date accessioned2017-05-09T00:37:12Z
date available2017-05-09T00:37:12Z
date copyrightSeptember, 2010
date issued2010
identifier issn1528-9044
identifier otherJEPAE4-26306#031001_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/142941
description abstractOptical noninvasive temperature measurement techniques, such as interferometry, are particularly advantageous in obtaining temperature information noninvasively from enclosed low velocity flows induced by thermal sources, as commonly arise in electronic systems. The single greatest restriction in the application of interferometry as a standard measurement methodology has been the enormous cost associated with the optical equipment required. This cost is due to the quality of the optics required, which exhibits an exponential dependence on size. Digital Moiré subtraction is a technique, which removes the restriction on the use of high quality optics, thereby, enabling reasonably large fields of view. In this paper, a digital Moiré subtraction interferometer configuration is presented with a 140 mm field of view. First, the ability of the interferometer to accurately measure the free convection temperature field about an isothermal horizontal cylinder is examined through a comparison with measurements from literature using classical interferometry. The technique is then applied to the thermal interaction between 2D components representing BGAs mounted on a vertical printed circuit board (PCB). Qualitative and quantitative evaluation of the interferograms show the significant influence of in-plane PCB conductivity on the temperature field about the PCB. The spacing to length ratio above, which upstream components on a PCB experience enhanced cooling, is reduced from 4 to 3 for a PCB with a high effective in-plane conductivity (15 W/m K).
publisherThe American Society of Mechanical Engineers (ASME)
titleDigital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures
typeJournal Paper
journal volume132
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4002161
journal fristpage31001
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsTemperature
keywordsInterferometry
keywordsInterferometers
keywordsCylinders
keywordsConductivity
keywordsMeasurement
keywordsNatural convection
keywordsComputer cooling AND Cooling
treeJournal of Electronic Packaging:;2010:;volume( 132 ):;issue: 003
contenttypeFulltext


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