| contributor author | Yu-Tang Yen | |
| contributor author | Te-Hua Fang | |
| contributor author | Yu-Cheng Lin | |
| date accessioned | 2017-05-09T00:37:11Z | |
| date available | 2017-05-09T00:37:11Z | |
| date copyright | December, 2010 | |
| date issued | 2010 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26309#041005_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/142927 | |
| description abstract | This paper investigates the application of a Taguchi method to reduce warpage problem dealing with process parameters during production of bonding sheets. For this purpose, analysis was carried out by utilizing a combination of process parameters based on a two-level L12 Taguchi orthogonal design. The signal-to-noise and the analysis of variance are used to find the optimum levels and to indicate the impact of the process parameters on warpage. The results show that the method can reduce warpage by about 94%, and a verification test is also conducted to prove its effectiveness after the optimum levels of process parameters are determined. It can thus be concluded that this Taguchi method is suitable to solve the quality problems that occur due to warpage. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Application of a Taguchi Method Technique in Determining the Laminating Process Parameters for a Bonding Sheet | |
| type | Journal Paper | |
| journal volume | 132 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4002723 | |
| journal fristpage | 41005 | |
| identifier eissn | 1043-7398 | |
| keywords | Bonding | |
| keywords | Warping | |
| keywords | Taguchi methods AND Design | |
| tree | Journal of Electronic Packaging:;2010:;volume( 132 ):;issue: 004 | |
| contenttype | Fulltext | |
