| contributor author | Changsoo Jang | |
| contributor author | Bongtae Han | |
| contributor author | Samson Yoon | |
| contributor author | Seungbae Park | |
| date accessioned | 2017-05-09T00:27:37Z | |
| date available | 2017-05-09T00:27:37Z | |
| date copyright | March, 2008 | |
| date issued | 2008 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26283#011004_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/137782 | |
| description abstract | We propose an advanced thermal-moisture analogy scheme to cope with the inherent limitations of the existing analogy schemes. The new scheme is based on the experimentally observed unique hygroscopic behavior of polymeric materials used in microelectronics; i.e., the saturated concentration is only a function of relative humidity regardless of temperature. A new analogy formulation based on the modified solubility is presented and the scheme is implemented to investigate its accuracy and applicability. The results from a simple case study corroborate that the advanced scheme can be used effectively for package assemblies subjected to general anisothermal loading conditions. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem | |
| type | Journal Paper | |
| journal volume | 130 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2837521 | |
| journal fristpage | 11004 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature AND Diffusion (Physics) | |
| tree | Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 001 | |
| contenttype | Fulltext | |
