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contributor authorFang Liu
contributor authorJunfeng Zhao
contributor authorGuang Meng
contributor authorMei Zhao
date accessioned2017-05-09T00:27:36Z
date available2017-05-09T00:27:36Z
date copyrightJune, 2008
date issued2008
identifier issn1528-9044
identifier otherJEPAE4-26285#021007_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/137771
description abstractSolder joint reliability in drop test is crucial for handheld systems, such as mobile phone, digital camera, and MP3 player. In recent years, a lot of experiments and simulations have been carried out by researchers to study board level drop test, and many useful results have been obtained. Regarding mechanical simulation and analysis, there are still two challenges: How to design drop test printed circuit board (PCB) based on dynamic simulation and analysis? How to get accurate elastic modulus of PCB, especially damping parameters, as property inputs for drop test simulation? In this study, an approach based on systematic modal tests and analyses is used to address these two challenges. First, modal dynamic simulation is used to design the test board to meet drop test requirements. Second, modal tests are conducted on drop test board in order to validate dynamic simulation and measure structural damping parameters and overall board elastic modulus as well. Adopted directly in drop test simulation, the measured damping parameters and elastic modulus are proved to be accurate. It is verified through comparison between the finite element simulation and real drop test results. With the modal tests and simulation method established here, drop simulation becomes very simple and accurate, and test board design and characterization are also simplified. Thus, considerable drop test experiment and simulation fine tune, and validation work can be saved.
publisherThe American Society of Mechanical Engineers (ASME)
titleBoard Level Drop Test Analysis Based on Modal Test and Simulation
typeJournal Paper
journal volume130
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2912212
journal fristpage21007
identifier eissn1043-7398
keywordsSimulation
keywordsDrops
keywordsPrinted circuit board assemblies
keywordsDamping
keywordsDesign AND Elastic moduli
treeJournal of Electronic Packaging:;2008:;volume( 130 ):;issue: 002
contenttypeFulltext


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