| contributor author | Wataru Nakayama | |
| date accessioned | 2017-05-09T00:27:33Z | |
| date available | 2017-05-09T00:27:33Z | |
| date copyright | December, 2008 | |
| date issued | 2008 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26289#041108_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/137748 | |
| description abstract | This paper reports the design study performed on a heat conduction panel having several heat sources at separate locations and a heat sink on one of the panel corners. The panel is given a thickness distribution so as to provide spatially varying heat conduction paths from the heat sources to the heat sink. The objective of thickness distribution design is to reduce the variation among heat source temperatures and the maximum heat source temperature simultaneously. The genetic algorithm is used to search for an optimum thickness distribution. The problem is a generic representation of the situations that are becoming common in a compact electronic equipment. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Design of Heat Conduction Panel: The Case of Multiple Heating Elements Cooled by a Displaced Heat Sink | |
| type | Journal Paper | |
| journal volume | 130 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2993137 | |
| journal fristpage | 41108 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat | |
| keywords | Temperature | |
| keywords | Heat conduction | |
| keywords | Design | |
| keywords | Heat sinks | |
| keywords | Thickness | |
| keywords | Tiles AND Heating | |
| tree | Journal of Electronic Packaging:;2008:;volume( 130 ):;issue: 004 | |
| contenttype | Fulltext | |
