| contributor author | Chang-Lin Yeh | |
| contributor author | Yi-Shao Lai | |
| date accessioned | 2017-05-09T00:23:28Z | |
| date available | 2017-05-09T00:23:28Z | |
| date copyright | March, 2007 | |
| date issued | 2007 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26272#98_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/135593 | |
| description abstract | The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles, the ball impact test process is analyzed to provide insights into transient characteristics of this particular test methodology. A design guideline for the ball impact test apparatus based on characteristics of the measured impact force profile is proposed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Design Guideline for Ball Impact Test Apparatus | |
| type | Journal Paper | |
| journal volume | 129 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2429716 | |
| journal fristpage | 98 | |
| journal lastpage | 104 | |
| identifier eissn | 1043-7398 | |
| keywords | Force | |
| keywords | Design | |
| keywords | Solder joints | |
| keywords | Impact testing | |
| keywords | Fracture (Process) | |
| keywords | Damping | |
| keywords | Brittleness AND Drops | |
| tree | Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001 | |
| contenttype | Fulltext | |
