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contributor authorKatsuhiko Sasaki
contributor authorKen-ichi Ohguchi
contributor authorTakuji Kobayashi
date accessioned2017-05-09T00:23:28Z
date available2017-05-09T00:23:28Z
date copyrightMarch, 2007
date issued2007
identifier issn1528-9044
identifier otherJEPAE4-26272#82_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135591
description abstractTime-dependent deformations such as creep and ratchetting of solder alloys are significant deformation phenomena that need to be understood to ensure the safety and reliability of solder joints in electronic packaging. There is much research on creep deformation of solder alloys, but ratchetting deformation, especially the correlation between creep and ratchetting deformation of solder alloys has not been investigated. This paper discusses the correlation between creep and uniaxial ratchetting deformation to establish the differences in the time-dependent deformation of lead-free and lead-containing solder alloys. Uniaxial ratchetting tests were conducted by cyclic tension–compression tests or cyclic tension–unloading tests at several ratios of the maximum to minimum stresses. Additional creep tests following the uniaxial ratchetting were also conducted to observe the effect of the uniaxial ratchetting on creep deformation. An empirical method to select an optimal lead-free solder alloy is discussed by defining a uniaxial ratchetting strain rate. The additional creep tests also show that the uniaxial ratchetting deformation has a strong correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys.
publisherThe American Society of Mechanical Engineers (ASME)
titleExperimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn∕37Pb and Sn∕3Ag∕0.5Cu Solder Alloys
typeJournal Paper
journal volume129
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2429714
journal fristpage82
journal lastpage89
identifier eissn1043-7398
keywordsDeformation
keywordsCreep
keywordsAlloys
keywordsSolders
keywordsStress AND Lead-free solders
treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001
contenttypeFulltext


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