| contributor author | Jennie S. Hwang | |
| contributor author | Anthony J. Rafanelli | |
| date accessioned | 2017-05-09T00:23:25Z | |
| date available | 2017-05-09T00:23:25Z | |
| date copyright | March, 2007 | |
| date issued | 2007 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26272#109_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/135576 | |
| description abstract | Lead-Free Implementation and Production–A Manufacturing Guide,. McGraw-Hill, New York, NY, 2005, 473 pp., $99.95, ISBN: 0-07-144374-6 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Lead-Free Implementation and Production–A Manufacturing Guide | |
| type | Journal Paper | |
| journal volume | 129 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2429719 | |
| journal fristpage | 109 | |
| journal lastpage | 110 | |
| identifier eissn | 1043-7398 | |
| keywords | Manufacturing AND Solders | |
| tree | Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 001 | |
| contenttype | Fulltext | |
