| contributor author | Samson Yoon | |
| contributor author | Zhaoyang Wang | |
| contributor author | Bongtae Han | |
| date accessioned | 2017-05-09T00:23:18Z | |
| date available | 2017-05-09T00:23:18Z | |
| date copyright | December, 2007 | |
| date issued | 2007 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26280#421_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/135525 | |
| description abstract | Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) direct analogy and (2) normalized analogy. The schemes are implemented to define valid domains of application. The results corroborate that the direct analogy is valid only for single-material systems, but the normalized analogy can be extended to multimaterial systems if thermal loading conditions are isothermal, spatially as well as temporally. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | On Moisture Diffusion Modeling Using Thermal-Moisture Analogy | |
| type | Journal Paper | |
| journal volume | 129 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2804090 | |
| journal fristpage | 421 | |
| journal lastpage | 426 | |
| identifier eissn | 1043-7398 | |
| keywords | Diffusion (Physics) | |
| keywords | Equations | |
| keywords | Temperature AND Heat transfer | |
| tree | Journal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004 | |
| contenttype | Fulltext | |
