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contributor authorC. J. Fang
contributor authorM. C. Wu
contributor authorY. M. Kuo
contributor authorC. Y. Lee
contributor authorC. H. Peng
contributor authorY. H. Hung
date accessioned2017-05-09T00:23:18Z
date available2017-05-09T00:23:18Z
date copyrightDecember, 2007
date issued2007
identifier issn1528-9044
identifier otherJEPAE4-26280#400_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/135522
description abstractA series of experimental investigations on the studies related to fluid flow and transient mixed convection from a horizontally unconfined stationary or rotating ceramic-based multichip module (MCM) disk with unconfined jet impingement have been successfully conducted. The fluid flow and heat transfer behavior explored includes the streamwise velocity and turbulence intensity distributions, transient dimensionless temperature distribution on the MCM disk surface, transient heat flux distribution of input power, and transient chip and average heat transfer characteristics on the MCM disk surface. Besides, two new correlations of transient stagnation and average Nusselt numbers in terms of jet Reynolds number, ratio of jet separation distance to nozzle diameter and time elapsed during the transient period, are presented for the cases of stationary MCM disk. For the cases of rotating MCM disk, a complete composite correlation of steady-state average Nusselt number for mixed convection due to jet impingement, disk rotation and buoyancy is proposed. As compared with the steady-state results, if the transient chip and average heat transfer behaviors may be considered as a superposition of a series of quasisteady states, the transient chip and average Nusselt numbers in all the present transient experiments can be properly predicted by the existing steady-state correlations when t>6min in the power-on transient period.
publisherThe American Society of Mechanical Engineers (ASME)
titleHeat Transfer Behavior for a Stationary or Rotating MCM Disk With an Unconfined Round Jet Impingement
typeJournal Paper
journal volume129
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2804087
journal fristpage400
journal lastpage410
identifier eissn1043-7398
keywordsReynolds number
keywordsNozzles
keywordsDisks
keywordsHeat transfer
keywordsMulti-chip modules
keywordsTurbulence
keywordsSteady state AND Rotation
treeJournal of Electronic Packaging:;2007:;volume( 129 ):;issue: 004
contenttypeFulltext


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