| contributor author | Peter M. Teertstra | |
| contributor author | M. Michael Yovanovich | |
| contributor author | J. Richard Culham | |
| date accessioned | 2017-05-09T00:19:37Z | |
| date available | 2017-05-09T00:19:37Z | |
| date copyright | June, 2006 | |
| date issued | 2006 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26263#157_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/133547 | |
| description abstract | An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located at the center of an isothermal, cuboid shaped enclosure. A composite model is developed based on asymptotic solutions for three limiting cases: pure conduction, laminar boundary layer convection, and transition flow convection. The conduction shape factor and natural convection models are validated using data from CFD simulations for a wide range of enclosure geometries and flow conditions. The model is shown to be in good agreement, to within 10% RMS, with the numerical data for all test configurations. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Modeling of Natural Convection in Electronic Enclosures | |
| type | Journal Paper | |
| journal volume | 128 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2188953 | |
| journal fristpage | 157 | |
| journal lastpage | 165 | |
| identifier eissn | 1043-7398 | |
| keywords | Computational fluid dynamics | |
| keywords | Convection | |
| keywords | Engineering simulation | |
| keywords | Heat conduction | |
| keywords | Natural convection | |
| keywords | Shapes | |
| keywords | Flow (Dynamics) | |
| keywords | Model validation | |
| keywords | Boundary layers AND Modeling | |
| tree | Journal of Electronic Packaging:;2006:;volume( 128 ):;issue: 002 | |
| contenttype | Fulltext | |
