Special Issue With Contributions From ITherm 2004

Abstract

Since its inception 20 years ago, ITherm, The Intersociety Conference on Thermal, Mechanical, and Thermomechanical Phenomena in Electronic Systems, has been addressing recent advances in the area of thermal management, mechanical, and thermomechanical issues in electronic packages and systems. The conference has enjoyed the support of IEEE CPMT Society, which is its prime sponsor, and the ASME Heat Transfer Division's K-16 Committee on Cooling of Electronic Equipment. During these 20 years, ITherm has steadily grown and maintained a good balance of papers presented in the areas of thermal, mechanical, and emerging technologies. It has become a practice to publish selected papers from ITherm conferences in IEEE Transactions Components and Packaging Technologies. For the first time some of these papers are published in the Journal of Electronic Packaging with contributions from Thermal Management and Emerging Technologies Tracks of ITherm 2004. Of the 14 papers originally invited, 11 appear in this issue after peer review. A brief summary of these papers follows.