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contributor authorW. A. Khan
contributor authorJ. R. Culham
contributor authorM. M. Yovanovich
date accessioned2017-05-09T00:19:31Z
date available2017-05-09T00:19:31Z
date copyrightDecember, 2006
date issued2006
identifier issn1528-9044
identifier otherJEPAE4-26266#324_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/133493
description abstractThe following study will examine the effect on overall thermal/fluid performance associated with different fin geometries, including, rectangular plate fins as well as square, circular, and elliptical pin fins. The use of entropy generation minimization, EGM, allows the combined effect of thermal resistance and pressure drop to be assessed through the simultaneous interaction with the heat sink. A general dimensionless expression for the entropy generation rate is obtained by considering a control volume around the pin fin including base plate and applying the conservations equations for mass and energy with the entropy balance. The formulation for the dimensionless entropy generation rate is developed in terms of dimensionless variables, including the aspect ratio, Reynolds number, Nusselt number, and the drag coefficient. Selected fin geometries are examined for the heat transfer, fluid friction, and the minimum entropy generation rate corresponding to different parameters including axis ratio, aspect ratio, and Reynolds number. The results clearly indicate that the preferred fin profile is very dependent on these parameters.
publisherThe American Society of Mechanical Engineers (ASME)
titleThe Role of Fin Geometry in Heat Sink Performance
typeJournal Paper
journal volume128
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2351896
journal fristpage324
journal lastpage330
identifier eissn1043-7398
keywordsDrag (Fluid dynamics)
keywordsReynolds number
keywordsEntropy
keywordsHeat transfer
keywordsGeometry
keywordsHeat sinks
keywordsThermal resistance
keywordsHeat transfer coefficients
keywordsViscosity
keywordsEquations
keywordsFins AND Pressure drop
treeJournal of Electronic Packaging:;2006:;volume( 128 ):;issue: 004
contenttypeFulltext


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