| contributor author | Ying Feng Pang | |
| contributor author | Jonah Zhou Chen | |
| contributor author | Karen A. Thole | |
| contributor author | Elaine P. Scott | |
| date accessioned | 2017-05-09T00:15:55Z | |
| date available | 2017-05-09T00:15:55Z | |
| date copyright | March, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26242#59_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131674 | |
| description abstract | A methodology was developed and implemented to optimize the design layout for i_ntegrated p_ower e_lectronics m_odules (IPEMs) by considering both the electrical and thermal performances. This paper is primarily focused on the thermal aspects, which were analyzed using three-dimensional (3D) computational software tools. Implementation of the design methodology resulted in a 70 percent reduction in the common mode current, a 4 percent reduction in the size of the geometric footprint, and a 7°C reduction in the maximum temperature rise for the case studied, thus, providing an increase in the IPEM’s overall performance. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Design and Optimization Methodology for Integrated Power Electronics Modules | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1849233 | |
| journal fristpage | 59 | |
| journal lastpage | 66 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Design | |
| keywords | Ceramics | |
| keywords | Copper AND Optimization | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 001 | |
| contenttype | Fulltext | |
