| contributor author | J. Cepeda-Rizo | |
| contributor author | Hsien-Yang Yeh | |
| date accessioned | 2017-05-09T00:15:54Z | |
| date available | 2017-05-09T00:15:54Z | |
| date copyright | June, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26243#185_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131660 | |
| description abstract | The paper presents a study of creep behavior of a printed wiring board caused by the mechanical fastening of separable connector, known as a land grid array. Time-temperature superposition method was employed to predict the lifetime creep behavior. A low-cost testing method based on the ASTM D790 three-point bending procedure was developed to predict and characterize creep of polymeric materials under low temperature, low stress, and large elapsed times. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Creep Prediction of a Printed Wiring Board For Separable Land Grid Array Connector | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1899164 | |
| journal fristpage | 185 | |
| journal lastpage | 188 | |
| identifier eissn | 1043-7398 | |
| keywords | Creep | |
| keywords | Temperature | |
| keywords | Printed circuit boards AND Stress | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002 | |
| contenttype | Fulltext | |
