| contributor author | J. Cepeda-Rizo | |
| contributor author | N. Teneketges | |
| contributor author | Hsien-Yang Yeh | |
| date accessioned | 2017-05-09T00:15:54Z | |
| date available | 2017-05-09T00:15:54Z | |
| date copyright | June, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26243#178_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131659 | |
| description abstract | The paper presents a study on printed wiring board (PWB) warpage caused by the mechanical fastening of separable interconnects, known as land grid array (LGA) package assemblies. Out-of-plane displacement of the PWB were measured and characterized, as well as force-per-pin values of the LGA, and correlations were made between the two. Classical laminate theory was utilized to describe the warpage behavior of the assembly and a model was presented to solve the out-of-plane displacements. An overall assessment of the assembly was made and compared to the mechanical specification of the LGA. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Characterization and Modeling of Printed Wiring Board Warpage and its Effect on LGA Separable Interconnects | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1898339 | |
| journal fristpage | 178 | |
| journal lastpage | 184 | |
| identifier eissn | 1043-7398 | |
| keywords | Measurement | |
| keywords | Force | |
| keywords | Warping | |
| keywords | Printed circuit boards | |
| keywords | Approximation | |
| keywords | Sensors | |
| keywords | Laminates | |
| keywords | Pressure | |
| keywords | Displacement AND Stress | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 002 | |
| contenttype | Fulltext | |
