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contributor authorJun Xu
contributor authorRichard A. Wirtz
date accessioned2017-05-09T00:15:52Z
date available2017-05-09T00:15:52Z
date copyrightSeptember, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26247#353_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131641
description abstractAlgebraic models of porosity, specific surface area, and in-plane effective thermal conductivity for stacked, two-dimensional symmetric diamond-weave screen laminations are developed and benchmarked with laboratory experiments. Diamond-weave laminations are found to have greater metal fractions and specific surface area than equivalent orthogonal-weaves. With the weave angle smaller than 90°, the structure also has a much higher effective thermal conductivity.
publisherThe American Society of Mechanical Engineers (ASME)
titleIn-Plane Effective Thermal Conductivity of Symmetric, Diamond-Weave Screen Laminates
typeJournal Paper
journal volume127
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1997162
journal fristpage353
journal lastpage356
identifier eissn1043-7398
keywordsLaminates
keywordsThermal conductivity
keywordsDiamonds
keywordsMetals AND Porosity
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003
contenttypeFulltext


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