| contributor author | Sihai Wen | |
| contributor author | D. D. Chung | |
| date accessioned | 2017-05-09T00:15:51Z | |
| date available | 2017-05-09T00:15:51Z | |
| date copyright | September, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26247#235_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131625 | |
| description abstract | The relative dielectric constant (10 kHz) of alumina was found to increase reversibly (by up to 13%) with compressive stress (up to 18 MPa). The effect of stress on the relative dielectric constant diminishes with increasing stress, such that it is almost absent when the stress exceeds ∼7MPa. The relative dielectric constant is higher during loading than subsequent unloading. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Effect of Stress on the Dielectric Constant of Alumina | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1939029 | |
| journal fristpage | 235 | |
| journal lastpage | 236 | |
| identifier eissn | 1043-7398 | |
| keywords | Stress AND Compressive stress | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003 | |
| contenttype | Fulltext | |
