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contributor authorH. Bhowmik
contributor authorC. P. Tso
contributor authorK. W. Tou
date accessioned2017-05-09T00:15:51Z
date available2017-05-09T00:15:51Z
date copyrightSeptember, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26247#215_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131622
description abstractSteady-state experiments are performed to study the convection heat transfer from four in-line simulated chips in a vertical rectangular channel using water as the working fluid. The experimental data cover a wide range for laminar flow under natural, mixed, and forced convection conditions with the Reynolds number based on the channel hydraulic diameter ranging from 40 to 2220 and on the heat source length ranging from 50 to 2775. The heat flux ranges from 0.1W∕cm2to0.6W∕cm2. The effects of heat flux, flow rates, and chip number are investigated and results indicate that the Nusselt number is strongly affected by the Reynolds number. To develop empirical correlations, the appropriate value of the exponent n of ReD is determined to collapse all the lines into a single line to show the independence of heat flux. Based on experimental results, the empirical correlations are developed for relations using Nuℓ, ReD, and GrD. The results are compared to predictions from a three-dimensional numerical simulation, and a numerical correlation is also developed.
publisherThe American Society of Mechanical Engineers (ASME)
titleAnalyses of Convection Heat Transfer From Discrete Heat Sources in a Vertical Rectangular Channel
typeJournal Paper
journal volume127
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1938207
journal fristpage215
journal lastpage222
identifier eissn1043-7398
keywordsHeat
keywordsChannels (Hydraulic engineering)
keywordsComputer simulation
keywordsConvection
keywordsFlow (Dynamics)
keywordsForced convection
keywordsEquations
keywordsHeat flux
keywordsFluids
keywordsReynolds number
keywordsSteady state AND Water
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003
contenttypeFulltext


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