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contributor authorC. Basaran
contributor authorY. Zhao
contributor authorH. Tang
contributor authorJ. Gomez
date accessioned2017-05-09T00:15:51Z
date available2017-05-09T00:15:51Z
date copyrightSeptember, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26247#208_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131621
description abstractSn-Pb eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature, eutectic Sn-Pb solder exhibits creep-fatigue interaction and significant time-, temperature-, stress-, and rate-dependent material characteristics. The microstructure is often unstable, having significant effects on the flow behavior of solder joints at high homologous temperatures. Such complex behavior makes constitutive modeling an extremely difficult task. A viscoplasticity model unified with a thermodynamics-based damage concept is presented. The proposed model takes into account isotropic and kinematic hardening, and grain size coarsening evolution. The model is verified against various test data, and shows strong application potential for modeling thermal viscoplastic behavior and fatigue life of solder joints in microelectronics packaging.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Damage-Mechanics-Based Constitutive Model for Solder Joints
typeJournal Paper
journal volume127
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1939822
journal fristpage208
journal lastpage214
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsCreep
keywordsTemperature
keywordsSolders
keywordsStress
keywordsHardening
keywordsConstitutive equations
keywordsSolder joints
keywordsAlloys
keywordsGrain size
keywordsFatigue life AND Thermodynamics
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 003
contenttypeFulltext


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