| contributor author | Ming-Chang Wu | |
| contributor author | Tiao-Yuan Wu | |
| contributor author | Sheng-Tzung Kuo | |
| contributor author | Meng-Ping Wang | |
| contributor author | Ying-Huei Hung | |
| date accessioned | 2017-05-09T00:15:50Z | |
| date available | 2017-05-09T00:15:50Z | |
| date copyright | December, 2005 | |
| date issued | 2005 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26254#474_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/131610 | |
| description abstract | A series of experimental investigations with a new modified transient liquid crystal method on the studies related to the fluid flow and heat transfer characteristics in a channel installed with a heat sink have been successfully performed. The parametric studies on the local and average effective heat transfer characteristics for confined heat sinks have been explored. The influencing parameters and conditions include air preheating temperature at channel inlet, flow velocity and heat sink types. Besides, a concept of the amount of enhanced heat transfer (AEHT) is introduced and defined as the ratio of j∕f. The j∕f ratio is almost independent of Reynolds number for a specific confined heat sink. The j∕f ratios are 0.0603 and 0.0124 for fully-confined and unconfined heat sinks, respectively. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Performance Investigation for Confined Heat Sinks By Using a Modified Transient Liquid Crystal Technique | |
| type | Journal Paper | |
| journal volume | 127 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2065787 | |
| journal fristpage | 474 | |
| journal lastpage | 482 | |
| identifier eissn | 1043-7398 | |
| keywords | Flow (Dynamics) | |
| keywords | Temperature | |
| keywords | Heat transfer | |
| keywords | Liquid crystals | |
| keywords | Channels (Hydraulic engineering) | |
| keywords | Heat sinks AND Heat transfer coefficients | |
| tree | Journal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004 | |
| contenttype | Fulltext | |