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contributor authorXu Chen
contributor authorLinda Zhai
contributor authorShufeng Zhao
date accessioned2017-05-09T00:15:50Z
date available2017-05-09T00:15:50Z
date copyrightDecember, 2005
date issued2005
identifier issn1528-9044
identifier otherJEPAE4-26254#460_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/131608
description abstractThe moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick’s Law, but it does not strictly obey at higher temperature and humidity. The phenomena can be attributed to the occurrence of the second phase, and the Fick’s Law can be modified by diffusion coefficient varying with the moisture concentration. The predicted value by the modified Fick’s Law agrees with the test data. At certain temperature, the saturated moisture content of molding compound is proportional to the relative humidity, and the proportional factor is the product of solubility and saturated vapor pressure. The solubility is a physical characteristic, which has no relations with the relative humidity of ambient air.
publisherThe American Society of Mechanical Engineers (ASME)
titleMoisture Absorption and Diffusion Characterization of Molding Compound
typeJournal Paper
journal volume127
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.2065707
journal fristpage460
journal lastpage465
identifier eissn1043-7398
keywordsDiffusion (Physics)
keywordsAbsorption
keywordsMolding AND Temperature
treeJournal of Electronic Packaging:;2005:;volume( 127 ):;issue: 004
contenttypeFulltext


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