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    Thermal Shock Strength of a Semi-infinite Piezoelectric Medium

    Source: Journal of Engineering Materials and Technology:;2004:;volume( 126 ):;issue: 004::page 450
    Author:
    Bao-Lin Wang
    ,
    Yu-Guo Sun
    DOI: 10.1115/1.1789964
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper considers the mechanical problem of a semi-infinite piezoelectric medium under sudden thermal load. The medium contains an electrically conducting crack perpendicular to its surface. The transient stresses and electric fields in an uncracked medium are calculated first. Then, these stresses and electric fields are used as the crack surface traction and electric field loads with opposite signs to formulate the mixed boundary value problem. Numerical results for the stress and electric field intensity factors are calculated as a function of normalized time and crack size. Crack propagation behavior is discussed. The parameters that control the transient thermal stress and electric fields are also identified. The maximum thermal shock strength that the material can sustain without catastrophic failure is established according to two distinct criteria: (i) maximum local tensile stress equals the tensile strength of the medium, and (ii) maximum stress intensity factor for the preexisting representative crack equals the fracture toughness of the medium. The results show that the influence of the piezoelectric effects on the thermal stress intensity factor is insignificant.
    keyword(s): Electric fields , Stress , Thermal stresses , Fracture (Materials) , Boundary-value problems , Thermal shock , Temperature , Failure , Tension , Traction AND Temperature distribution ,
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      Thermal Shock Strength of a Semi-infinite Piezoelectric Medium

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    http://yetl.yabesh.ir/yetl1/handle/yetl/130102
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    contributor authorBao-Lin Wang
    contributor authorYu-Guo Sun
    date accessioned2017-05-09T00:13:07Z
    date available2017-05-09T00:13:07Z
    date copyrightOctober, 2004
    date issued2004
    identifier issn0094-4289
    identifier otherJEMTA8-27063#450_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/130102
    description abstractThis paper considers the mechanical problem of a semi-infinite piezoelectric medium under sudden thermal load. The medium contains an electrically conducting crack perpendicular to its surface. The transient stresses and electric fields in an uncracked medium are calculated first. Then, these stresses and electric fields are used as the crack surface traction and electric field loads with opposite signs to formulate the mixed boundary value problem. Numerical results for the stress and electric field intensity factors are calculated as a function of normalized time and crack size. Crack propagation behavior is discussed. The parameters that control the transient thermal stress and electric fields are also identified. The maximum thermal shock strength that the material can sustain without catastrophic failure is established according to two distinct criteria: (i) maximum local tensile stress equals the tensile strength of the medium, and (ii) maximum stress intensity factor for the preexisting representative crack equals the fracture toughness of the medium. The results show that the influence of the piezoelectric effects on the thermal stress intensity factor is insignificant.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Shock Strength of a Semi-infinite Piezoelectric Medium
    typeJournal Paper
    journal volume126
    journal issue4
    journal titleJournal of Engineering Materials and Technology
    identifier doi10.1115/1.1789964
    journal fristpage450
    journal lastpage456
    identifier eissn1528-8889
    keywordsElectric fields
    keywordsStress
    keywordsThermal stresses
    keywordsFracture (Materials)
    keywordsBoundary-value problems
    keywordsThermal shock
    keywordsTemperature
    keywordsFailure
    keywordsTension
    keywordsTraction AND Temperature distribution
    treeJournal of Engineering Materials and Technology:;2004:;volume( 126 ):;issue: 004
    contenttypeFulltext
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