Show simple item record

contributor authorBao-Lin Wang
contributor authorYu-Guo Sun
date accessioned2017-05-09T00:13:07Z
date available2017-05-09T00:13:07Z
date copyrightOctober, 2004
date issued2004
identifier issn0094-4289
identifier otherJEMTA8-27063#450_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/130102
description abstractThis paper considers the mechanical problem of a semi-infinite piezoelectric medium under sudden thermal load. The medium contains an electrically conducting crack perpendicular to its surface. The transient stresses and electric fields in an uncracked medium are calculated first. Then, these stresses and electric fields are used as the crack surface traction and electric field loads with opposite signs to formulate the mixed boundary value problem. Numerical results for the stress and electric field intensity factors are calculated as a function of normalized time and crack size. Crack propagation behavior is discussed. The parameters that control the transient thermal stress and electric fields are also identified. The maximum thermal shock strength that the material can sustain without catastrophic failure is established according to two distinct criteria: (i) maximum local tensile stress equals the tensile strength of the medium, and (ii) maximum stress intensity factor for the preexisting representative crack equals the fracture toughness of the medium. The results show that the influence of the piezoelectric effects on the thermal stress intensity factor is insignificant.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Shock Strength of a Semi-infinite Piezoelectric Medium
typeJournal Paper
journal volume126
journal issue4
journal titleJournal of Engineering Materials and Technology
identifier doi10.1115/1.1789964
journal fristpage450
journal lastpage456
identifier eissn1528-8889
keywordsElectric fields
keywordsStress
keywordsThermal stresses
keywordsFracture (Materials)
keywordsBoundary-value problems
keywordsThermal shock
keywordsTemperature
keywordsFailure
keywordsTension
keywordsTraction AND Temperature distribution
treeJournal of Engineering Materials and Technology:;2004:;volume( 126 ):;issue: 004
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record