Show simple item record

contributor authorLi-Kang Liu
contributor authorWen-Shien Su
contributor authorYing-Huei Hung
date accessioned2017-05-09T00:12:47Z
date available2017-05-09T00:12:47Z
date copyrightMarch, 2004
date issued2004
identifier issn1528-9044
identifier otherJEPAE4-26228#159_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129906
description abstractTransient heat transfer behavior from a horizontally confined ceramic-based MCM disk with jet impingement has been systematically explored. The relevant parameters influencing heat transfer performance are the steady-state Grashof number, jet Reynolds number, and ratio of jet separation distance to nozzle diameter. In addition, an effective time, ton, representing a certain transient time when the mixed convection effect due to jet impingement and buoyancy becomes significant relative to heat conduction, is introduced. Both the transient chip and average Nusselt numbers on the MCM disk surface decrease with time in a very beginning period of 0≤t<ton, whereas it gradually increases or keeps constant with time and finally approaches the steady-state value in the period of ton≤t<ts. As compared with the steady-state results, if the transient chip and average heat transfer behaviors may be considered as a superposition of a series of quasi-steady states, the transient chip and average Nusselt numbers in all the present transient experiments can be properly predicted by the existing steady-state correlations when t≥4 min in the power-on transient period.
publisherThe American Society of Mechanical Engineers (ASME)
titleTransient Convective Heat Transfer of Air Jet Impinging Onto a Confined Ceramic-Based MCM Disk
typeJournal Paper
journal volume126
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1649239
journal fristpage159
journal lastpage172
identifier eissn1043-7398
keywordsHeat transfer
keywordsCeramics
keywordsAir jets
keywordsDisks
keywordsSteady state
keywordsMulti-chip modules
keywordsReynolds number
keywordsConvection
keywordsTemperature AND Nozzles
treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record