| contributor author | Seungmin Cho | |
| contributor author | Jinwon Joo | |
| contributor author | Bongtae Han | |
| date accessioned | 2017-05-09T00:12:45Z | |
| date available | 2017-05-09T00:12:45Z | |
| date copyright | March, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26228#41_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129885 | |
| description abstract | A robust scheme of moiré interferometry for real-time observation is employed to study the temperature dependent thermo-mechanical behavior of a ceramic ball grid array package assembly. The scheme is implemented with a convection-type environmental chamber that provides the rapid temperature control required in accelerated thermal cycling. Thermal deformations are documented at various temperatures. Thermal-history dependent analyses of global and local deformations are presented. A significant nonlinear global behavior is documented due to complete stress relaxation at the maximum temperature. An analysis of solder interconnections reveals that inelastic deformation accumulates at the bottom eutectic solder fillet only at high temperatures. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Temperature Dependent Deformation Analysis of Ceramic Ball Grid Array Package Assembly Under Accelerated Thermal Cycling Condition | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1646426 | |
| journal fristpage | 41 | |
| journal lastpage | 47 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Temperature | |
| keywords | Ceramics | |
| keywords | Interferometry | |
| keywords | Solders | |
| keywords | Manufacturing | |
| keywords | Ball-Grid-Array packaging | |
| keywords | Stress AND Displacement | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001 | |
| contenttype | Fulltext | |
