| contributor author | Li Ming Yu | |
| contributor author | Wang Chun Qing | |
| contributor author | Zhang Lei | |
| contributor author | Bang Han Sur | |
| contributor author | Kim Young Pyo | |
| date accessioned | 2017-05-09T00:12:44Z | |
| date available | 2017-05-09T00:12:44Z | |
| date copyright | March, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26228#22_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129881 | |
| description abstract | Solder bridging is one of the most serious defects of solder joint in fine pitch device assemblies. It is known that the generation of solder bridging is closely related to the forming process of solder joints. To simulate the process, a 3D model is formed. Then it is numerically simulated using Surface Evolver program. Based on the results, the solder bridging mechanism and the effective factors including wetting angle and surface tension are investigated. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Simulative Analysis on Factors Influencing Solder Joint Bridging of Fine Pitch Devices | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1646421 | |
| journal fristpage | 22 | |
| journal lastpage | 25 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Solder joints AND Wetting (Surface science) | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 001 | |
| contenttype | Fulltext | |
