| contributor author | Chandrakant S. Desai | |
| contributor author | Russell Whitenack | |
| contributor author | Tribikram Kundu | |
| contributor author | Zhichao Wang | |
| date accessioned | 2017-05-09T00:12:44Z | |
| date available | 2017-05-09T00:12:44Z | |
| date copyright | June, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26233#232_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129871 | |
| description abstract | The compendium paper (Part 1: Models and Testing) presents details of the thermomechanical-digital image correction (TM-DIC) for testing of solders, test plan under variable temperature and strain rates for 63/37 Sn/Pb solder, and typical test results. This paper (Part 2: Calibration and Validation) presents determination of DSC parameters based on the test results, dependence of parameters on temperature and strain rates, and typical validation with respect to test data and predictions from finite element method with the DSC model for chip-substrate problem. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Testing and Modeling of Solders Using New Test Device, Part 2: Calibration and Validation | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1756147 | |
| journal fristpage | 232 | |
| journal lastpage | 236 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Modeling | |
| keywords | Testing | |
| keywords | Calibration | |
| keywords | Stress | |
| keywords | Boundary-value problems AND Temperature | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 002 | |
| contenttype | Fulltext | |
