Show simple item record

contributor authorLiu Chen
contributor authorAnders S. G. Andræ
contributor authorGang Zou
contributor authorJohan Liu
date accessioned2017-05-09T00:12:43Z
date available2017-05-09T00:12:43Z
date copyrightJune, 2004
date issued2004
identifier issn1528-9044
identifier otherJEPAE4-26233#195_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129865
description abstractSystem-in-a-Package (SiP) aims to integrate the entire system functions within a system-level package containing multiple ICs and other components interconnected in a high-density substrate. A structure based on the SiP concept is proposed in this paper. Based on this SiP structure, four substrate candidates, namely FR4, liquid crystal polymer (LCP), teflon (PTFE) and low temperature co-fired ceramic (LTCC) were compared by assessing and measuring their mechanical reliability, electrical performance and environmental influence. First, to evaluate long-term reliability, the 3D finite element method (FEM) was used to calculate the stress distribution and warpage of the whole package. Both three-point bending and cooling in the manufacturing process were taken into consideration. The LCP has a coefficient of thermal expansion (CTE) close to that of the silicon chip, and a Young’s module close to that of FR4, which gave the best reliability in both bending and cooling situations. Next, the dielectric constants and the loss tangent for the four substrates were evaluated in the electrical performance investigation. The LCP has a low relative dielectric constant and a low dissipation factor for the frequency range 1 GHz to 35 GHz, making it a good substrate for high frequency applications. An environmental assessment included several environmental impact categories; this assessment indicated that LCP is the most environmentally acceptable substrate.
publisherThe American Society of Mechanical Engineers (ASME)
titleCharacterization of Substrate Materials for System-in-a-Package Applications
typeJournal Paper
journal volume126
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1648057
journal fristpage195
journal lastpage201
identifier eissn1043-7398
keywordsDensity
keywordsMicrowaves
keywordsCeramics
keywordsManufacturing
keywordsReliability
keywordsLiquid crystalline polymers
keywordsEnergy dissipation
keywordsWarping
keywordsFinite element model
keywordsSystem-in-package
keywordsCooling
keywordsLow temperature
keywordsSilicon chips
keywordsTransfer functions
keywordsEpoxy adhesives
keywordsThermal expansion
keywordsGlass fibers
keywordsCopper
keywordsStress concentration AND Engineering simulation
treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 002
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record