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contributor authorRobert J. Moffat
date accessioned2017-05-09T00:12:40Z
date available2017-05-09T00:12:40Z
date copyrightDecember, 2004
date issued2004
identifier issn1528-9044
identifier otherJEPAE4-26239#501_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129832
description abstractIn all electronics cooling situations, and many other practical situations, the surface temperature may vary rapidly in the streamwise direction. In these cases, defining the heat transfer coefficient using the adiabatic temperature of the surface instead of the mixed mean temperature of the coolant results in significant benefits. The resulting coefficient, called hadiabatic, is well behaved, being a function only of the geometry and flow characteristics. Calling attention to Tadiabatic, as opposed to Tmean, helps designers identify the root cause of overheating problems and more quickly reach good solutions. The theoretical and practical bases for hadiabatic are presented. Examples of its use in electronics cooling are described to show the operational advantages this approach offers. Turbulence strongly affects heat transfer. A simple, turbulence-based correlation is presented that yields an estimate of the heat transfer coefficient good enough for preliminary design estimates and often as accurate as can be relied on from CFD calculations using present codes.
publisherThe American Society of Mechanical Engineers (ASME)
titlehadiabatic and umax′
typeJournal Paper
journal volume126
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1827265
journal fristpage501
journal lastpage509
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsTemperature AND Heat transfer
treeJournal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004
contenttypeFulltext


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