| contributor author | Han-Ting Chen | |
| contributor author | Jenn-Tsong Horng | |
| contributor author | Po-Li Chen | |
| contributor author | Ying-Huei Hung | |
| date accessioned | 2017-05-09T00:12:39Z | |
| date available | 2017-05-09T00:12:39Z | |
| date copyright | December, 2004 | |
| date issued | 2004 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26239#410_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/129820 | |
| description abstract | An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed in the study. The thermal and hydrodynamic performance analyzers for PPF heat sinks have been developed. A screening experimental design using the Taguchi method is performed to determine key factors that are critical to the design and screen out unimportant design factors; and a Response Surface Methodology is then applied to establish analytical models for the thermal resistance and pressure drop in terms of the key design factors with a CCD experimental design. By employing the Sequential Quadratic Programming technique, a series of constrained optimal designs can be efficiently performed. Comparisons between these predicted optimal designs and those evaluated by the theoretical calculations are made with satisfactory agreement. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Optimal Design for PPF Heat Sinks in Electronics Cooling Applications | |
| type | Journal Paper | |
| journal volume | 126 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1826078 | |
| journal fristpage | 410 | |
| journal lastpage | 422 | |
| identifier eissn | 1043-7398 | |
| keywords | Design | |
| keywords | Heat sinks AND Heat | |
| tree | Journal of Electronic Packaging:;2004:;volume( 126 ):;issue: 004 | |
| contenttype | Fulltext | |