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    Thermoelastic Instability of Two-Conductor Friction System Including Surface Roughness

    Source: Journal of Applied Mechanics:;2004:;volume( 071 ):;issue: 001::page 57
    Author:
    J. Y. Jang
    ,
    M. M. Khonsari
    DOI: 10.1115/1.1629756
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A model is developed to investigate the mechanism of thermoelastic instability (TEI) in tribological components. The model consists of two thermally conducting bodies of finite thickness undergoing sliding contact. Appropriate governing equations are derived to predict the critical speed beyond which the TEI is likely to occur. This model takes into account the surface roughness characteristics of the contacting bodies as well as the thermal contact conductance at the interface. Analytical expressions are provided for the special cases neglecting the disk thickness and the thermal contact conductance. An extensive series of parametric simulations and discussion of the implication of the results are also presented. The simulations show that the difference in material properties and geometry of the two conducting bodies has a pronounced influence on the critical speed. A special case of the model shows that the threshold of TEI critical speed is pushed to a much higher level when the conducting bodies have identical material properties and are geometrically symmetric. It is also shown that the perturbed wave generally tends to move with the body with higher thermal conductivity.
    keyword(s): Friction , Surface roughness , Waves , Disks , Thickness , Contact resistance , Equations , Engineering simulation , Geometry , Materials properties , Shear (Mechanics) , Stress , Thermal conductivity AND Elastic moduli ,
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      Thermoelastic Instability of Two-Conductor Friction System Including Surface Roughness

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    http://yetl.yabesh.ir/yetl1/handle/yetl/129533
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    • Journal of Applied Mechanics

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    contributor authorJ. Y. Jang
    contributor authorM. M. Khonsari
    date accessioned2017-05-09T00:12:11Z
    date available2017-05-09T00:12:11Z
    date copyrightJanuary, 2004
    date issued2004
    identifier issn0021-8936
    identifier otherJAMCAV-26571#57_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/129533
    description abstractA model is developed to investigate the mechanism of thermoelastic instability (TEI) in tribological components. The model consists of two thermally conducting bodies of finite thickness undergoing sliding contact. Appropriate governing equations are derived to predict the critical speed beyond which the TEI is likely to occur. This model takes into account the surface roughness characteristics of the contacting bodies as well as the thermal contact conductance at the interface. Analytical expressions are provided for the special cases neglecting the disk thickness and the thermal contact conductance. An extensive series of parametric simulations and discussion of the implication of the results are also presented. The simulations show that the difference in material properties and geometry of the two conducting bodies has a pronounced influence on the critical speed. A special case of the model shows that the threshold of TEI critical speed is pushed to a much higher level when the conducting bodies have identical material properties and are geometrically symmetric. It is also shown that the perturbed wave generally tends to move with the body with higher thermal conductivity.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermoelastic Instability of Two-Conductor Friction System Including Surface Roughness
    typeJournal Paper
    journal volume71
    journal issue1
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.1629756
    journal fristpage57
    journal lastpage68
    identifier eissn1528-9036
    keywordsFriction
    keywordsSurface roughness
    keywordsWaves
    keywordsDisks
    keywordsThickness
    keywordsContact resistance
    keywordsEquations
    keywordsEngineering simulation
    keywordsGeometry
    keywordsMaterials properties
    keywordsShear (Mechanics)
    keywordsStress
    keywordsThermal conductivity AND Elastic moduli
    treeJournal of Applied Mechanics:;2004:;volume( 071 ):;issue: 001
    contenttypeFulltext
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