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    Deposition of Diamond in Copper by Triboadhesion

    Source: Journal of Manufacturing Science and Engineering:;2003:;volume( 125 ):;issue: 003::page 628
    Author:
    J. M. Rodrı́guez Lelis
    ,
    J. Colı́n Ocempo
    ,
    J. Porcayo Calderón
    ,
    J. M. Robles
    DOI: 10.1115/1.1557297
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns depth can be formed. This film has particles from 10 to 1 microns and the concentration of diamond decreases with depth. A change on the crystalline structure caused by temperatures closer to the melting point achieved by the process was also found.
    keyword(s): Temperature , Copper , Particulate matter , Diamonds , Friction , Melting point AND Coating processes ,
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      Deposition of Diamond in Copper by Triboadhesion

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/128683
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    contributor authorJ. M. Rodrı́guez Lelis
    contributor authorJ. Colı́n Ocempo
    contributor authorJ. Porcayo Calderón
    contributor authorJ. M. Robles
    date accessioned2017-05-09T00:10:42Z
    date available2017-05-09T00:10:42Z
    date copyrightAugust, 2003
    date issued2003
    identifier issn1087-1357
    identifier otherJMSEFK-27739#628_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128683
    description abstractIn the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns depth can be formed. This film has particles from 10 to 1 microns and the concentration of diamond decreases with depth. A change on the crystalline structure caused by temperatures closer to the melting point achieved by the process was also found.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDeposition of Diamond in Copper by Triboadhesion
    typeJournal Paper
    journal volume125
    journal issue3
    journal titleJournal of Manufacturing Science and Engineering
    identifier doi10.1115/1.1557297
    journal fristpage628
    journal lastpage630
    identifier eissn1528-8935
    keywordsTemperature
    keywordsCopper
    keywordsParticulate matter
    keywordsDiamonds
    keywordsFriction
    keywordsMelting point AND Coating processes
    treeJournal of Manufacturing Science and Engineering:;2003:;volume( 125 ):;issue: 003
    contenttypeFulltext
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