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contributor authorJ. M. Rodrı́guez Lelis
contributor authorJ. Colı́n Ocempo
contributor authorJ. Porcayo Calderón
contributor authorJ. M. Robles
date accessioned2017-05-09T00:10:42Z
date available2017-05-09T00:10:42Z
date copyrightAugust, 2003
date issued2003
identifier issn1087-1357
identifier otherJMSEFK-27739#628_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128683
description abstractIn the present work, it is shown that friction can be used to deposit diamond in a substrate of copper. Here it was found through electronic scan microscopy that a composite material film that varies from 27 to 30 microns depth can be formed. This film has particles from 10 to 1 microns and the concentration of diamond decreases with depth. A change on the crystalline structure caused by temperatures closer to the melting point achieved by the process was also found.
publisherThe American Society of Mechanical Engineers (ASME)
titleDeposition of Diamond in Copper by Triboadhesion
typeJournal Paper
journal volume125
journal issue3
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.1557297
journal fristpage628
journal lastpage630
identifier eissn1528-8935
keywordsTemperature
keywordsCopper
keywordsParticulate matter
keywordsDiamonds
keywordsFriction
keywordsMelting point AND Coating processes
treeJournal of Manufacturing Science and Engineering:;2003:;volume( 125 ):;issue: 003
contenttypeFulltext


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