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contributor authorY. H. Yan
contributor authorJ. M. Ochterbeck
date accessioned2017-05-09T00:09:55Z
date available2017-05-09T00:09:55Z
date copyrightJune, 2003
date issued2003
identifier issn1528-9044
identifier otherJEPAE4-26218#251_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128230
description abstractA cylindrical capillary pumped loop evaporator operating under steady-state conditions was studied using a two-dimensional numerical model. Parameters affecting the phase conditions in the wick structure and thermal-fluid behavior in the evaporator liquid core were studied. The influences of heat load, liquid subcooling, and effective thermal conductivity of the wick structure were specifically selected to evaluate evaporator performance. Either increasing the applied heat flux and/or degree of inlet liquid subcooling resulted in decreased liquid core temperature, which is favorable for proper evaporator operation. This helps prevent conditions that may allow vapor formation in the liquid core as well as result in decreased length of the two-phase region in the wick structure. Decreasing the effective thermal conductivity of the wick also decreases the temperature in the liquid core. For a given liquid subcooling, a minimum heat flux exists below which vapor will generate in the liquid core and render the evaporator nonoperational. Additionally, for a given heat flux, a minimum required liquid subcooling exists as conditions are such that vapor potentially may form in the liquid core when the liquid subcooling is less than a minimum value.
publisherThe American Society of Mechanical Engineers (ASME)
titleNumerical Investigation of the Steady-State Operation of a Cylindrical Capillary Pumped Loop Evaporator
typeJournal Paper
journal volume125
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1569509
journal fristpage251
journal lastpage260
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsHeat
keywordsTemperature
keywordsVapors
keywordsEquations
keywordsSteady state
keywordsSubcooling
keywordsHeat flux
keywordsHeat transfer
keywordsChannels (Hydraulic engineering)
keywordsFluids
keywordsPressure
keywordsMixtures
keywordsThermal conductivity
keywordsBoundary-value problems
keywordsPorous materials AND Stress
treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 002
contenttypeFulltext


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