| contributor author | John H. Lau | |
| contributor author | Stephen H. Pan | |
| contributor author | Chris Chang | |
| date accessioned | 2017-05-09T00:07:11Z | |
| date available | 2017-05-09T00:07:11Z | |
| date copyright | September, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26206#212_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126614 | |
| description abstract | A new empirical equation for predicting the thermal-fatigue life of wafer level chip scale package (WLCSP) solder joints on printed circuit board (PCB) is presented. The solder joints are subjected to thermal cycling and their crack lengths at different thermal cycles are measured. Also, the average strain energy density around the crack tip of different crack lengths in the corner solder joint is determined by a time-dependent nonlinear fracture mechanics with finite element method. The solder is assumed to be a temperature-dependent elastic-plastic and a time-dependent creep material. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1462625 | |
| journal fristpage | 212 | |
| journal lastpage | 220 | |
| identifier eissn | 1043-7398 | |
| keywords | Fatigue | |
| keywords | Fracture (Materials) | |
| keywords | Corners (Structural elements) | |
| keywords | Solder joints | |
| keywords | Solders | |
| keywords | Cycles | |
| keywords | Semiconductor wafers AND Density | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003 | |
| contenttype | Fulltext | |
