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contributor authorJohn H. Lau
contributor authorStephen H. Pan
contributor authorChris Chang
date accessioned2017-05-09T00:07:11Z
date available2017-05-09T00:07:11Z
date copyrightSeptember, 2002
date issued2002
identifier issn1528-9044
identifier otherJEPAE4-26206#212_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126614
description abstractA new empirical equation for predicting the thermal-fatigue life of wafer level chip scale package (WLCSP) solder joints on printed circuit board (PCB) is presented. The solder joints are subjected to thermal cycling and their crack lengths at different thermal cycles are measured. Also, the average strain energy density around the crack tip of different crack lengths in the corner solder joint is determined by a time-dependent nonlinear fracture mechanics with finite element method. The solder is assumed to be a temperature-dependent elastic-plastic and a time-dependent creep material.
publisherThe American Society of Mechanical Engineers (ASME)
titleA New Thermal-Fatigue Life Prediction Model for Wafer Level Chip Scale Package (WLCSP) Solder Joints
typeJournal Paper
journal volume124
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1462625
journal fristpage212
journal lastpage220
identifier eissn1043-7398
keywordsFatigue
keywordsFracture (Materials)
keywordsCorners (Structural elements)
keywordsSolder joints
keywordsSolders
keywordsCycles
keywordsSemiconductor wafers AND Density
treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003
contenttypeFulltext


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