| contributor author | John H. Lau | |
| contributor author | S. W. Ricky Lee | |
| contributor author | Stephen H. Pan | |
| contributor author | Chris Chang | |
| date accessioned | 2017-05-09T00:07:11Z | |
| date available | 2017-05-09T00:07:11Z | |
| date copyright | September, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26206#205_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126613 | |
| description abstract | An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1462626 | |
| journal fristpage | 205 | |
| journal lastpage | 211 | |
| identifier eissn | 1043-7398 | |
| keywords | Creep | |
| keywords | Solders | |
| keywords | Solder joints AND Flip-chip | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003 | |
| contenttype | Fulltext | |
