| contributor author | Pradeep Sharma | |
| contributor author | Abhijit Dasgupta | |
| date accessioned | 2017-05-09T00:07:10Z | |
| date available | 2017-05-09T00:07:10Z | |
| date copyright | September, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26206#292_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126597 | |
| description abstract | This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth, and void coalescence model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding, its blocking at second-phase particles, and diffusional creep relaxation. In Part II of this paper, the developed creep-fatigue damage model is quantified and parametric studies are provided to better illustrate the utility of the developed model. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1493202 | |
| journal fristpage | 292 | |
| journal lastpage | 297 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Grain boundaries | |
| keywords | Stress | |
| keywords | Creep | |
| keywords | Fatigue | |
| keywords | Nucleation (Physics) | |
| keywords | Particulate matter | |
| keywords | Micromechanics (Engineering) AND Fatigue damage | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003 | |
| contenttype | Fulltext | |
