Study of P-V-T-C Relation of EMC
| contributor author | Yi-San Chang | |
| contributor author | Huei-Huang Lee | |
| contributor author | Durn-Yuan Huang | |
| contributor author | Sheng-Jye Hwang | |
| date accessioned | 2017-05-09T00:07:09Z | |
| date available | 2017-05-09T00:07:09Z | |
| date copyright | December, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26210#371_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126585 | |
| description abstract | A two-plunger-type dilatometer was designed and fabricated to measure cure-induced volume changes of epoxy molding compound (EMC). The device is suitable for studying volume change of material systems that are fast reacting and with high conversions and high viscosity like commercial EMC. In this paper, the conversion rate was determined by DSC. Interactions of volume change, pressure, temperature, and conversion were measured. In the experiment, two different temperatures: 172°C,180°C and four different pressures: 30, 50, 80, and 100 kgf/cm2 were applied. The total number of conditions in this experiment is 8. Volume change of EMC due to thermal expansion, cure shrinkage, and thermal contraction under fixed temperature and pressure was measured. For higher pressure, the final volume change will be higher. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Study of P-V-T-C Relation of EMC | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1498266 | |
| journal fristpage | 371 | |
| journal lastpage | 373 | |
| identifier eissn | 1043-7398 | |
| keywords | Pressure | |
| keywords | Thermal expansion | |
| keywords | Temperature | |
| keywords | Viscosity | |
| keywords | Molding | |
| keywords | Epoxy adhesives AND Shrinkage (Materials) | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
| contenttype | Fulltext |
