| contributor author | Ki-Ju Kang | |
| contributor author | Tae-Sung Bae | |
| contributor author | Seon-Ho Choi | |
| date accessioned | 2017-05-09T00:07:08Z | |
| date available | 2017-05-09T00:07:08Z | |
| date copyright | December, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26210#385_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126565 | |
| description abstract | Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from the intermetallics. As a result, it was shown that the long cast time yielded the intermetallics and microstructures of the solder invariable regardless of aging condition. The granular micro-structure of the air-cooled specimens was shown to be inferior to the laminated micro-structure of the furnace-cooled specimens. Also, transition of fatigue crack behavior with ΔJ and the procedure of fatigue crack propagation from the pre-crack tip were discussed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Near-Threshold Fatigue Crack Growth at 63Sn37Pb Solder Joints | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1510863 | |
| journal fristpage | 385 | |
| journal lastpage | 390 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Stress | |
| keywords | Fracture (Materials) | |
| keywords | Fatigue cracks | |
| keywords | Solder joints | |
| keywords | Intermetallic compounds AND High temperature | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
| contenttype | Fulltext | |
