Foreword
| contributor author | Marta Rencz | |
| contributor author | Guest Editor | |
| contributor author | Clemens Lasance | |
| contributor author | Guest Editor | |
| date accessioned | 2017-05-09T00:04:38Z | |
| date available | 2017-05-09T00:04:38Z | |
| date copyright | December, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26198#321_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125071 | |
| description abstract | Microelectronics thermal experts from four continents gathered in the fall of 2000 at the Sixth Therminic Workshop, Budapest, Hungary. THERMINIC is sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society, and the European Test Technology Technical Committee. Previous THERMINIC Workshops have been held in Grenoble (1995), Budapest (1996), Cannes (1997 and 1998), Rome (1999). | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Foreword | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1389845 | |
| journal fristpage | 321 | |
| journal lastpage | 322 | |
| identifier eissn | 1043-7398 | |
| keywords | Workshops (Work spaces) | |
| keywords | Electronic packaging | |
| keywords | Microelectronic devices AND Packaging | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004 | |
| contenttype | Fulltext |
