| contributor author | J. K. Chen | |
| contributor author | D. Y. Tzou | |
| contributor author | J. E. Beraun | |
| date accessioned | 2017-05-09T00:04:38Z | |
| date available | 2017-05-09T00:04:38Z | |
| date copyright | March, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26189#52_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125064 | |
| description abstract | A dual-phase-lag diffusion (DPLD) model is presented for predicting the intermetallic compound (IMC) layer growth in solder joints. It extends from Fick’s law by taking into account the delayed response between the interdiffusion of two dissimilar materials and the chemical reaction that forms the IMC. The merit of this model is that it uniquely represents four different types of IMC growth kinetics, all of which are found in the literature. Comparison between the model and experimental results for 100Sn/Cu and Ag/Zn systems demonstrates that the proposed DPLD model captures the growth history of IMC layers quite well. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Dual-Phase-Lag Diffusion Model for Predicting Intermetallic Compound Layer Growth in Solder Joints | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1326438 | |
| journal fristpage | 52 | |
| journal lastpage | 57 | |
| identifier eissn | 1043-7398 | |
| keywords | Diffusion (Physics) | |
| keywords | Intermetallic compounds | |
| keywords | Solder joints | |
| keywords | Thickness AND Equations | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001 | |
| contenttype | Fulltext | |
