| contributor author | Krishna Darbha | |
| contributor author | Abhijit Dasgupta | |
| date accessioned | 2017-05-09T00:04:36Z | |
| date available | 2017-05-09T00:04:36Z | |
| date copyright | June, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26192#147_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125044 | |
| description abstract | The nested finite element methodology (NFEM) presented in Part I of this series, is used in this paper to analyze the viscoplastic stress-state in a flip-chip-on-board (FCOB) and a chip scale package subjected to temperature cycling loads. The results are validated with conventional finite element method (CFEM). An energy-partitioning (EP) damage model is used to predict cycles to failure, based on the energy densities obtained from NFEM and CFEM, and results are compared with experiments. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products—Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1328745 | |
| journal fristpage | 147 | |
| journal lastpage | 155 | |
| identifier eissn | 1043-7398 | |
| keywords | Creep | |
| keywords | Solders | |
| keywords | Durability | |
| keywords | Finite element analysis | |
| keywords | Stress | |
| keywords | Stress | |
| keywords | Stress analysis (Engineering) | |
| keywords | Flip-chip devices | |
| keywords | Integrated circuits | |
| keywords | Pitch (Bituminous material) | |
| keywords | Electronic products | |
| keywords | Materials properties | |
| keywords | Solder joints | |
| keywords | Cycles | |
| keywords | Temperature AND Failure | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 002 | |
| contenttype | Fulltext | |
