| contributor author | A. G. Evans | |
| contributor author | M. Y. He | |
| contributor author | J. W. Hutchinson | |
| contributor author | M. Shaw | |
| date accessioned | 2017-05-09T00:04:35Z | |
| date available | 2017-05-09T00:04:35Z | |
| date copyright | September, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26195#211_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125030 | |
| description abstract | A thermal analysis has been performed for a package design pertinent to power electronics. The objective has been the derivation of straightforward expressions that relate the materials used and their physical dimensions to the power input and the junction temperature. This has been done for both steady-state operating conditions and for pulses. The role of phase change materials (PCMs) in suppressing temperature elevations during pulses is also addressed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Temperature Distribution in Advanced Power Electronics Systems and the Effect of Phase Change Materials on Temperature Suppression During Power Pulses | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1370376 | |
| journal fristpage | 211 | |
| journal lastpage | 217 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Design | |
| keywords | Junctions | |
| keywords | Electronics | |
| keywords | Phase change materials | |
| keywords | Melting AND Steady state | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003 | |
| contenttype | Fulltext | |
