| contributor author | Xiangcheng Luo | |
| contributor author | Yunsheng Xu | |
| contributor author | D. D. L. Chung | |
| date accessioned | 2017-05-09T00:04:34Z | |
| date available | 2017-05-09T00:04:34Z | |
| date copyright | September, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26195#309_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125022 | |
| description abstract | Thermal interface pastes based on silicone, lithium doped polyethylene glycol (PEG), and sodium silicate were evaluated in their performance before and after heating up to 120°C. The thermal contact conductance of any of the pastes between copper disks decreased after heating, such that the fractional decrease was less for the silicone-based paste than the PEG-based and sodium-silicate-based pastes. Nevertheless, the conductance was lower for the silicone-based paste than the other pastes both before and after heating up to 100 cycles. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1371925 | |
| journal fristpage | 309 | |
| journal lastpage | 311 | |
| identifier eissn | 1043-7398 | |
| keywords | Copper | |
| keywords | Electrical conductance | |
| keywords | Disks | |
| keywords | Cycles | |
| keywords | Silicones | |
| keywords | Sodium | |
| keywords | Thermal stability | |
| keywords | Heating | |
| keywords | Contact resistance | |
| keywords | Lithium AND Temperature | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003 | |
| contenttype | Fulltext | |
