| contributor author | Boris Mirman | |
| contributor author | Emanuel Bobrov | |
| date accessioned | 2017-05-09T00:04:34Z | |
| date available | 2017-05-09T00:04:34Z | |
| date copyright | December, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26198#405_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125016 | |
| description abstract | Plastic compressive deformation of the copper layer at high temperatures is a significant contributor for die cracking in the under-bump-metallurgy (UBM) area of flip chips. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1400975 | |
| journal fristpage | 405 | |
| identifier eissn | 1043-7398 | |
| keywords | Metallurgy | |
| keywords | Fracture (Process) | |
| keywords | Flip-chip devices | |
| keywords | Deformation | |
| keywords | Copper AND High temperature | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004 | |
| contenttype | Fulltext | |
