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contributor authorMohamed-Nabil Sabry
date accessioned2017-05-09T00:04:34Z
date available2017-05-09T00:04:34Z
date copyrightDecember, 2001
date issued2001
identifier issn1528-9044
identifier otherJEPAE4-26198#344_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125015
description abstractHeat transfer in micro-channels, used as an efficient cooling method for electronic circuits, is revisited. Channel walls act as a fin conveying heat to the cooling fluid. The relatively low amount of fluid circulating and high micro-channel length-to-depth ratio will cause a significant temperature rise in the fluid between inlet and outlet. This will create a transverse temperature gradient normal to the prevailing temperature gradient in the channel walls. This 2D problem will be analytically solved for laminar incompressible flow with constant physical properties in order to get an accurate estimation of the fin efficiency subject to a 2D field of temperature difference.
publisherThe American Society of Mechanical Engineers (ASME)
titleTransverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design
typeJournal Paper
journal volume123
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.1390342
journal fristpage344
journal lastpage350
identifier eissn1043-7398
keywordsFlow (Dynamics)
keywordsHeat
keywordsTemperature
keywordsHeat transfer
keywordsFluids
keywordsChannels (Hydraulic engineering)
keywordsDesign
keywordsMicrochannels
keywordsTemperature gradients
keywordsEquations AND Cooling
treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004
contenttypeFulltext


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