Editor’s Note
| contributor author | Ephraim Suhir | |
| contributor author | Chi Shih Chang | |
| date accessioned | 2017-05-09T00:02:14Z | |
| date available | 2017-05-09T00:02:14Z | |
| date copyright | March, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26178#1_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123581 | |
| description abstract | [S1043-7398(00)01502-4] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Editor’s Note | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.483135 | |
| journal fristpage | 1 | |
| journal lastpage | 2 | |
| identifier eissn | 1043-7398 | |
| keywords | Electronic packaging | |
| keywords | Engineering teachers | |
| keywords | Packaging | |
| keywords | Teams | |
| keywords | Materials research | |
| keywords | Polymers | |
| keywords | Testing | |
| keywords | Solder joints AND Reliability | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 001 | |
| contenttype | Fulltext |
