| contributor author | Adam Kuhl | |
| contributor author | Jianmin Qu | |
| date accessioned | 2017-05-09T00:02:12Z | |
| date available | 2017-05-09T00:02:12Z | |
| date copyright | June, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26181#147_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123561 | |
| description abstract | An experimental technique using sandwiched Brazil-nut specimens to quantitatively characterize interfacial fracture toughness over a wide range of phase angles is presented. Specimens are made by sandwiching a thin layer of adhesive material between two metal substrates. Tensile loads are applied to the specimens at various loading angles. Through the use of fracture mechanics and finite element analysis, interfacial fracture toughness as a function of loading phase angle is determined from the experimentally obtained critical load and loading direction. The fracture toughness curves for several different Cu/adhesive systems are obtained. [S1043-7398(00)00302-9] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | A Technique to Measure Interfacial Toughness Over a Range of Phase Angles | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.483147 | |
| journal fristpage | 147 | |
| journal lastpage | 151 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 002 | |
| contenttype | Fulltext | |
